Assembly Bonding Polyurethane Hot Melt Adhesives Earphone Circuit Board Glue PUR-8860

Good Quality Factory Directly Earphone Assembly Bonding Hot Melt Adhesives PUR-8860

Wanli® PUR hot melt adhesive PUR-8860 for earphone assembly bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-8860 can be used for self-adhesion and mutual adhesion of PC, ABS, PVC and other plastics and aluminum, stainless steel and other metals. PUR-8860 is featured stable viscosity under heating at a certain temperature, high initial bonding strength and final bonding strength. After curing, it has good peeling strength, good heat&humidity resistance and chemical resistance. PUR-8860 is especially suitable for bonding applications in the electronic industry.

APPLICATION
Wanli® PUR hot melt adhesive PUR-8860 is used for earphone assembly bonding. Which can be used for self-adhesion and mutual adhesion of PC, ABS, PVC and other plastics and aluminum, stainless steel and other metals. PUR-8860 is especially suitable for bonding applications in the electronic industry.

FEATURE
PUR-8860 has stable viscosity.
High initial and final bonding strength when heated at a certain temperature.
It has good peel strength, good heat resistance, moisture resistance and chemical resistance after curing.

USER GUIDE
The package of PUR-8860 is suitable for various dispensing equipment.
The recommended operating temperature is about 110℃.
In order to complete curing, it is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 65% relative humidity).

STORAGE
Store the product in a dry, cool place away from direct sunlight. The storage temperature shall not exceed 35 ℃, and avoid open fire or heat source.

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Assembly Bonding Polyurethane Hot Melt Adhesives Earphone Circuit Board Glue PUR-8860 Images